FAQ

Rayton is working on a semiconductor breakthrough that addresses one of the biggest challenges in AI: energy consumption.

Rayton's proprietary manufacturing process uses GaN and SiC materials to reduce chip power usage by up to 70%, while enabling 10x greater yield from existing wafer supplies. With AI datacenter demand surging, our approach offers a scalable, cost-effective way to meet infrastructure needs without adding strain to the grid.

Another way to put it is:

Rayton manufactures ultra-thin gallium nitride (GaN) and silicon carbide (SiC) semiconductor wafers using a patented ion-implantation process powered by particle-accelerator technology.

Our process dramatically improves material efficiency and energy performance, producing wafers that help device manufacturers build more efficient AI datacenters, electric vehicles, power electronics, and renewable energy systems.

Modern electronics—especially AI data centers, EV power systems, and renewable energy infrastructure—are limited by energy efficiency and material costs.

Traditional wafer manufacturing consumes large amounts of expensive semiconductor material, delivers limited yield from each crystal, and leaves manufacturers exposed to supply chain constraints.

Rayton solves this by producing ultra-thin wafers that use far less material while improving device efficiency, lowering both manufacturing costs and operating energy consumption.

Rayton uses a patented ion-implantation process that embeds hydrogen ions into bulk semiconductor crystals using a particle accelerator.

This allows ultra-thin semiconductor layers to be cleanly separated from the crystal without traditional wire-saw cutting, which typically wastes large amounts of material.

The result is a wafer manufacturing process that:

• Produces multiple wafers from a single input wafer

• Reduces raw material waste

• Compatible with standard epitaxy and device fabrication processes

Rayton wafers provide three major benefits:

1. Lower Energy Consumption

Devices built on Rayton wafers can deliver 30–70% energy savings per device, improving efficiency for high-power applications such as AI datacenters and EV power electronics.

2. Lower Material Cost

Rayton’s process can produce up to 10× more wafers from the same semiconductor crystal, helping manufacturers scale output without waiting for new crystal growth capacity.

3. Strategic Supply Chain Advantages

• U.S.-based manufacturing

• Eligibility for CHIPS Act and Inflation Reduction Act incentives

• Access to government and defense contracts requiring domestic semiconductor supply

Domestic semiconductor production provides several advantages:

• Access to CHIPS and Science Act incentives

• Qualification for Inflation Reduction Act domestic content bonuses

• Supply chain security for critical industries

• Eligibility for U.S. government and defense contracts

By manufacturing wafers in the United States, Rayton helps strengthen the domestic semiconductor supply chain.

Rayton wafers support multiple high-growth industries including:

• AI Data Centers

• Electric Vehicles

• Renewable Energy Systems

• 5G and RF Communications

• Aerospace and Defense Electronics

• Industrial Power Electronics

These industries require high-performance semiconductor materials capable of handling high voltage, high temperature, and high frequency operation.

Rayton’s manufacturing approach improves sustainability by:

• Using far less compound semiconductor material per wafer through ultra-thin layer transfer

• Improving material utilization from existing crystals, reducing raw material consumption

• Enabling more efficient GaN and SiC power devices that reduce energy use in downstream systems

This helps reduce both manufacturing emissions and long-term energy consumption in electronics.

Rayton welcomes collaboration with semiconductor companies, foundries, and device manufacturers interested in evaluating our wafers.

Partnership opportunities include:

• wafer sampling and validation programs

• joint engineering development

• strategic supply agreements

• manufacturing partnerships

Companies interested in collaboration can contact Rayton to begin discussions.

Rayton collaborates with companies across the semiconductor ecosystem, including:

• SiC and GaN device manufacturers

• Power module integrators

• Semiconductor foundries

• Advanced packaging and chip integration partners
  

Our goal is to provide next-generation wafer materials that enable higher performance and lower cost semiconductor devices.

Yes. Rayton wafers are designed to be compatible with standard semiconductor manufacturing processes and equipment. Additionally, Rayton may tool the materials to fit your specific requirements.

This allows device manufacturers and foundries to adopt Rayton wafers without requiring major changes to existing fabrication infrastructure.

Rayton’s manufacturing platform is designed to scale using modular particle-accelerator systems.

Initial production systems can produce approximately 5 wafers per hour, with future expansion targeting 25 wafers per hour or more through parallel accelerator modules and production scaling.

Rayton’s wafer manufacturing platform is protected by patented ion-implantation technology and related semiconductor processing innovations.

These patents issued to Rayton provide a defensible position around ultra-thin wafer production using accelerator-based techniques, helping secure Rayton’s leadership in next-generation wafer manufacturing.

Yes. Earlier, Rayton explored applications related to solar energy materials and manufacturing.

As the company’s accelerator-based wafer technology advanced, Rayton pivoted to focus on GaN and SiC semiconductor wafer production, where the technology offers far greater impact in high-growth sectors such as AI computing, electric vehicles, and power electronics.

This strategic shift allows Rayton to apply its core technology to some of the fastest-growing and most energy-intensive markets in the global economy.

Rayton Solar has filed a Doing Business As (DBA) for "Rayton" The two names are for the same entity, Rayton Solar Inc. The previous investors are current owners and maintain the shares which were purchased in our previous rounds.

Over the past few years there has been significant change in the solar industry. Factors such as low cost Chinese manufactured panels, and trade tariffs have made it difficult for solar companies such as Sun Edison, Solar World, Vivint, and Solar City to continue with their business.

Management made the decision to create a diversification of Rayton’s product applications by switching our focus to GaN, SiC, and InP wafers rather than solar cells alone. The underlying idea is to protect our shareholders and business from volatile market conditions. GaN wafer production uses the same technology we have already developed and has applications in automotive, aerospace, 5G, LED, as well as solar industries.

We believe this is a stronger approach to commercialization and yields the path of least resistance. Once we are in a revenue generating phase then we could be in a position to shift focus towards solar once again provided that the market conditions allow for it.

The funds from the last round were used to construct a state of the art particle accelerator which powers our proprietary process. We ran an engineering team to nail down our exact wafer production process and design the systems that will be used in the Beta Phase of operations.

Additionally, we studied the industry and met with leading research institutions to find the product which offers Rayton the path of least resistance to a revenue generating phase.