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Rayton is working on a semiconductor breakthrough that addresses one of the biggest challenges in AI: energy consumption.
Rayton's proprietary manufacturing process uses GaN and SiC materials to reduce chip power usage by up to 70%, while enabling 10x greater yield from existing wafer supplies. With AI datacenter demand surging, our approach offers a scalable, cost-effective way to meet infrastructure needs without adding strain to the grid.
Another way to put it is:
Rayton manufactures ultra-thin gallium nitride (GaN) and silicon carbide (SiC) semiconductor wafers using a patented ion-implantation process powered by particle-accelerator technology.
Our process dramatically improves material efficiency and energy performance, producing wafers that help device manufacturers build more efficient AI datacenters, electric vehicles, power electronics, and renewable energy systems.


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